PI introduces 6-DOF MagLev systems for advanced packaging

Target applications include advanced packaging and hybrid bonding, wafer inspection, and high-resolution surface metrology.

The linear MagLev stage provides 400mm of travel in the primary axis, combined with auxiliary motion of 400um in Y and Z and angular motion of 1mrad. Active control of all six degrees of freedom enables precise positioning as well as force-controlled bonding with forces exceeding 100N. Configurations support acceleration up to 6g.

The rotary MagLev platform combines continuous rotation with active control of the remaining degrees of freedom, including height and tip/tilt. This allows the system to actively maintain positioning and alignment during wafer inspection and metrology processes.

Designed for atomic force microscopy and other high-resolution surface measurement applications, the MagLev scanner provides X/Y positioning resolution of 50 picometers across scan ranges up to 50mm.

Magnetic levitation nanopositioning systems replace mechanical bearings with actively controlled magnetic fields, eliminating friction, wear, lubrication, and bearing-related particle generation. Active six-axis control also allows positioning and alignment errors to be corrected electronically within a single motion platform, reducing the need to stack multiple mechanical positioning stages.