Posted to News on 16th Oct 2007, 00:00
No-drip solder paste formulation
EFD has introduced a new no-drip, SAC305 solder paste dispensing formulation for mechanical soldering. This lead-free, no-clean formulation is excellent for gap filling and application on vertical surfaces.
The new formulation was created to help customers solder a perfect joint around a heat tube (or heat sink) container. Research found that competitors' formulations would drip down the container during the reflow process and create an insufficient solder joint.
In contrast, EFD's no-drip formulation wets well and wicks around many metal surfaces like silver, silver-plated, nickel, brass, and copper to produce perfect solder joints.
