New from adhesives supplier Intertronics is Dymax Low Shrink OP-81-LS UV adhesive, which offers very low volumetric shrinkage. Designed for optical assembly applications that require precise alignment, the material cures in seconds on exposure to UV/visible light. It is single-part, solvent free and can bond dissimilar substrates. It is recommended for materials including polycarbonate, glass, acrylic and metal.
OP-81-LS has very low volumetric shrinkage during cure. Its epoxy chemistry enables a low coefficient of thermal expansion (CTE) and high glass transition temperature (Tg) for stability through thermal cycling, and low outgassing.