High-precision modular temperature controllers for demanding applications

The DTDM series supports Delta's commitment to developing smart, sustainable solutions. By enabling precise temperature control in critical manufacturing processes, the DTDM contributes to improved energy efficiency and reduced waste.

"In today's fast-paced manufacturing environments, our customers require precise control and flexibility, even under the most challenging conditions," says Martien Heesterbeek, Product Manager. "The DTDM Series delivers on this need, offering a highly accurate, adaptable, and efficient temperature control solution in a remarkably compact form factor. Its performance and data transfer capabilities are unmatched, making it ideal for the demanding requirements of the semiconductor industry and beyond."

The DTDM Series stands out with its Single DTDM Group architecture. This design supports a Measurement Host, up to seven Measurement Expansion Modules, eight I/O Expansion Modules, and a Communication Module, enabling a maximum of 32 PID loops and 128 input/output channels. This modularity allows for highly customised configurations tailored to specific application needs, simplifying system design and reducing overall footprint.

High Precision: The High-Precision Modular Temperature Controller DTDM Series utilises advanced control algorithms, like PID Cascade Control, Multi Loop Control, Feed-Forward Control, and Linearisation Table, combined with a highly integrated modular hardware design. This results in +/-0.1% high-precision temperature measurement and a 10 ms temperature sampling period, ensuring optimal process performance and temperature control accuracy.

Rapid Data Exchange: With EtherCAT communication and support for 10/100 Mbps auto-detection (IEEE 802.3/u), the DTDM Series ensures real-time monitoring and seamless integration, enabling faster control loops and improved process optimisation.

Modular and Compact Design: The DIN rail mounting system and compact design simplify installation and minimise space requirements. The Single DTDM Group architecture allows for flexible configuration and expansion.

Enhanced Control Capabilities:

- PID Cascade Control and Multi-Loop Control for faster response times and increased precision.

- Linearisation Table and Feed-Forward Control to eliminate non-linear temperature errors and compensate for known process disturbances.

- Status Database and Logic Operations for rapid response and reduced host computer load.

- Multi-channel PV Comparison and Alarm: This feature actively prevents temperature variations between channels, ensuring consistent and reliable temperature uniformity for critical processes.

- Input Switching and Input Redundancy for increased system reliability.

The DTDM Series is specifically designed for semiconductor wafer processing equipment, including Chemical Vapour Deposition (CVD), Physical Vapour Deposition (PVD), Oxidation and Diffusion furnaces, silicon etching machines, and Atomic Layer Deposition (ALD).

The semiconductor industry is experiencing rapid growth, with increasing demand for advanced manufacturing processes that require precise temperature control. The DTDM Series addresses this need by providing a high-performance, flexible, and reliable solution that meets the industry's evolving requirements.