Posted to News on 30th Oct 2025, 11:00
Enclosures optimised for wireless and cooling
BOPLA has introduced BoVersa, a new enclosure concept designed for next-generation IoT, wireless, embedded and instrumentation systems. Combining modern design with robust engineering, BoVersa delivers maximum flexibility for equipment designers while ensuring long-term reliability, even in challenging outdoor environments.
The enclosure can be configured for hand-held, tabletop, wall or pole-mounted applications, making it suitable for diverse fields such as security, measurement and communication technology.
A three-part enclosure structure - comprising a lower part, functional lid, and design cover - offers designers a high degree of flexibility. These components can be combined in various colours, with options for transparent or translucent lids, enabling lighting effects, visibility of displays, or a clean, closed design.
For wireless systems, BoVersa integrates a die-cast aluminium body with cooling fins combined with a plastic cover. This ensures both unhindered radio transmission and efficient thermal management, essential for electronics with high power density.
The point-symmetrical fin design guarantees uniform airflow in both vertical and horizontal mounting positions. This maximises cooling efficiency, stabilises internal temperature distribution and extends the service life of sensitive electronics.
BoVersa's robust construction makes it suitable for outdoor deployment. With protection class up to IP66 / IP68 (1.2m for 2h, DIN EN 60529) and use of PC UL 94 V0 material, the enclosure withstands environmental stresses while ensuring safety and durability. Integrated options include a pressure equalisation diaphragm and direct mounting tabs.
Key features of BoVersa include: transparent or translucent functional lids for displays and lighting effects; a wide range of colour combinations for custom branding; open or closed versions for keyboards, displays or seamless designs; hidden screws and optional die-cast aluminium covers for added stability; optional pole attachment accessory; and an integrated receptacle for pressure equalisation diaphragm.
BOPLA supports customers with a full box-build service, including mechanical processing, printing, engraving, lacquer finishing, PCB assembly, and custom colour schemes. A custom design sample service is also available to accelerate product development.
"With BoVersa, we are taking into account the growing requirements of users and expanding our portfolio in a targeted manner," says Andreas Kromer, head of development at BOPLA. "We offer a holistic solution for numerous applications, developed on the basis of current market needs."
