Henkel is expanding its portfolio in the field of thin organic Coating (TOC) with a new colour variant. This combines the proven properties of the technology with aesthetic benefits and is aimed at applications where both functionality and design are important - in the case of the pilot project, through a golden finish.

Siemens, has unveiled the latest significant updates to its Simcenter X software, a cloud-based environment that brings together the full breadth of simulation and optimisation technologies in a single, unified solution.

Wurth Elektronik expands its range of FeatherWing development boards to include the Daphnis-I FeatherWing Board. The energy-efficient Daphnis-I radio module installed on the board operates using the LoRaWAN 1.0.4 protocol (Long Range Wide Area Network).

Growing demand for defence electronics has increased the requirement for ROLEC's latest aluminium enclosures. ROLEC's IP-rated diecast enclosures are suitable for electronics in tracked and wheeled vehicles, warships and fleet auxiliaries, training/simulation technology, military cranes, and railways used for troop transport, logistics and supply.

Farnell has launched The DevKit HQ, a new online resource that brings together evaluation boards, development kits, single board computers (SBCs), tools and technical documents in one place.

Renishaw has announced the launch of a next-generation Build Processor (NxG BP), developed in collaboration with Materialise. The new software strengthens integration between Materialise Magics and Renishaw's RenAM metal AM systems, combining the proven flexibility of Materialise Magics with the productivity of Renishaw AM systems in a more streamline workflow.

Portescap has reached a major milestone in its aerospace journey: all three of its manufacturing facilities - West Chester, Pennsylvania; Mahape, India; and Mumbai, India - are now AS9100 certified. This achievement underscores the company's alignment with the aerospace industry's highest standards for quality and safety.

The Chomerics Division of Parker Hannifin Corporation is introducing THERM-A-GAP GEL 120, a one-component, dispensable, thermal interface material with a very high thermal conductivity performance.

The Lee Company has come up with an interesting solution to the problem of handling high cracking pressures in downhole oil and gas applications, by using two pressure relief valves in series.

SKF continues to re-imagine intelligent and clean rotation with the development of a new temperature-resistant, corrosion-tolerant steel for aeroengine bearings called ARCTIC15.