When designing custom housings for electrical/electronic equipment, FDB Panel Fittings asserts that it is essential to match door/frame depths to the door lock so as to ensure the required degree of sealing (IP rating) and gasket pull-down.
25th January 2024
METCASE has launched elegant new TECHNOMET-CONTROL aluminium enclosures for electronic control systems, panel PCs and HMI electronics. They are specifically designed for mounting on standard VESA brackets/arms, walls, machines and round poles.
25th January 2024
New from IDEC is the FT2J series, combining a PLC with an operator interface. This compact, energy-efficient solution offers a sleek design and advanced connectivity, perfect for space-constrained environments.
25th January 2024
Pepperl+Fuchs has introduced the intrinsically safe Smart-Ex 03, a new and resilient 5G- and Wi-Fi 6-enabled smartphone. The 6-inch device combines all the expertise and know-how of the Pepperl+Fuchs subsidiaries ECOM Instruments as a pioneer in intrinsically safe mobile devices, and Aava Mobile as an expert in industrial tablets and wireless technologies.
25th January 2024
With Automation1 XA4 and iXA4, Aerotech is launching two new digital PWM drives. The slimline single and multi-axis servo motor drives are designed for use with Aerotech’s Automation1 platform and offer a lower price compared to Aerotech’s higher performance drives.
25th January 2024
Phoenix Contact has demonstrated an integrated TSN system consisting of a controller and managed switches for Profinet. The TSN system enables the implementation of convergent IT/OT networks, including for AI applications such as machine learning.
24th January 2024
Teledyne FLIR has launched its improved K-Series firefighting and search and rescue (SAR) thermal imaging cameras (TICs). This TIC series now includes greater image clarity and sharpness, especially in low-contrast scenes, offering better overall perception to improve operator safety and efficiency.
24th January 2024
The Chomerics Division of Parker Hannifin has introduced two new versions of its SOFT-SHIELD multi-planar electrically conductive foam EMI shielding gasket: the more cost-effective SOFT-SHIELD 4840 for high-volume grounding applications; and SOFT-SHIELD 4860, a halogen-free EMI shielding gasket for use in high-temperature systems.
24th January 2024
Matt Parkes, AM strategic development manager at global engineering technologies company, Renishaw, explains the benefits of TEMPUS technology – a new innovation that mitigates the cost of recoating on build time and can enhance additive manufacturing (AM) productivity for Renishaw’s RenAM 500 series of metal AM systems.
24th January 2024